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CED CE Distribution S C10 8109 Heat Sink Compound silicone Type Z9 1 oz P5335055CED-S-C10-8109 https://cdnimages.opentip.com/full/CED/CED-S-C10-8109.jpg CE Distribution S C10 8109 Heat Sink Compound silicone Type Z9 1 oz Manufacturer Part Number: S-C10-8109Type Z9, 1 fluid ounce. Silicone base, extra high-efficiency heat transfer. Made in USA. For mounting transistors, diodes, rectifiers, and resistors. Thermal joint compound for any device where efficient cooling is desired.For effective transfer of heat between components & heat sinksWill not dry or hardenWhite pasteGrease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.Measurements and Specs Bleed @ 200°C, 24 Hrs0.50 %/Wt Consistency340 Dielectric Constant, 25°C @ 1,000 Hz4.90 Dielectric Strength, 0.05 in. Gap400 V/mil Dissipation Factor, 25°C @ 1,000 Hz0.0011 Evaporation @ 200°C, 24 Hrs0.50 %/Wt Flow Rate @ 50 Psi5 - 18 g per minute Operating Temperature (TJ)-55°C to 205°C Shelf Life5 years Specific Gravity @ 25°C2.2 Thermal Conductivity @ 36°C0.70 W/m.-K Volume1 oz. Volume Resistivity1.96 X 1015 ΩXcm Packaging Dimensions9.5 in. × 2.8 in. × 1 in. Weight (Packaging)0.182 lbs. Files Specification SheetAll Models Safety Data SheetAll Models 5335055 609722157612 0.1800lbs 0.00 0.00 0.00
CE Distribution
16.7400 2027-01-06 In Stock

CE Distribution S-C10-8109 Heat Sink Compound - silicone, Type Z9, 1 oz

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UPC: 609722157612
SKU: CED-S-C10-8109
Price: $16.74
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Product Description

Manufacturer Part Number: S-C10-8109

Type Z9, 1 fluid ounce. Silicone base, extra high-efficiency heat transfer. Made in USA. For mounting transistors, diodes, rectifiers, and resistors. Thermal joint compound for any device where efficient cooling is desired.

  • For effective transfer of heat between components & heat sinks
  • Will not dry or harden
  • White paste


Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.

Measurements and Specs




Files

warning tips WARNING: This product can expose you to chemicals which are known to the State of California to cause cancer, birth defects, or other reproductive harm. For more information, go to www.p65warnings.ca.gov.
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